Issued Patents 2002
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6469256 | Structure for high speed printed wiring boards with multiple differential impedance-controlled layers | Thomas R. Miller, Robert J. Testa, Kevin Unger, Michael Wozniak | 2002-10-22 |
| 6399896 | Circuit package having low modulus, conformal mounting pads | Frank J. Downes, Jr., Donald S. Farquhar, Robert M. Japp | 2002-06-04 |
| 6387830 | Method for reducing coefficient of thermal expansion in chip attach packages | Lawrence Robert Blumberg, Robert M. Japp, John Frank Surowka | 2002-05-14 |
| 6348738 | Flip chip assembly | Jean Dery, Frank D. Egitto, Luis J. Matienzo, Charles Ouellet, Luc Ouellet +2 more | 2002-02-19 |