Issued Patents 2002
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6395164 | Copper seed layer repair technique using electroless touch-up | Panayotis Andricacos, James E. Fluegel, John G. Gaudiello, Ronald D. Goldblatt, Milan Paunovic | 2002-05-28 |
| 6380075 | Method for forming an open-bottom liner for a conductor in an electronic structure and device formed | Cyril Cabral, Jr., Chao-Kun Hu, Fenton R. McFeely, Stephen M. Rossnagel, Andrew H. Simon | 2002-04-30 |
| 6358832 | Method of forming barrier layers for damascene interconnects | Daniel C. Edelstein, Timothy J. Dalton, John G. Gaudiello, Mahadevaiyer Krishnan, Maurice McGlashan-Powell +2 more | 2002-03-19 |