Issued Patents 2002
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6452276 | Ultra thin, single phase, diffusion barrier for metal conductors | Stephan A. Cohen, Fenton R. McFeely, Cevdet I. Noyan, John J. Yurkas, Robert Rosenberg | 2002-09-17 |
| 6451712 | Method for forming a porous dielectric material layer in a semiconductor device and device formed | Timothy J. Dalton, Stephen E. Greco, Jeffrey Hedrick, Satyanarayana V. Nitta, Sampath Purushothaman +1 more | 2002-09-17 |
| 6448173 | Aluminum-based metallization exhibiting reduced electromigration and method therefor | Lawrence A. Clevenger, Ronald G. Filippi, Roy Iggulden, Chao-Kun Hu, Lynne M. Gignac +3 more | 2002-09-10 |
| 6429523 | Method for forming interconnects on semiconductor substrates and structures formed | Panayotis Andricacos, Cyril Cabral, Jr., John M. Cotte, Lynne M. Gignac, Wilma Jean Horkans | 2002-08-06 |
| 6413866 | Method of forming a solute-enriched layer in a substrate surface and article formed thereby | Horatio S. Wildman, Lawrence A. Clevenger, Chenting Lin, Stefan Weber, Roy Iggulden +2 more | 2002-07-02 |
| 6396151 | Partially-overlapped interconnect structure and method of making | Evan G. Colgan, Jeffery P. GAMBINO | 2002-05-28 |
| 6383066 | Multilayered polishing pad, method for fabricating, and use thereof | Shyng-Tsong Chen, Alex Siu Keung Chung, Oscar K. Hsu, Jean Vangsness | 2002-05-07 |
| 6346175 | Modification of in-plate refractory metal texture by use of refractory metal/nitride layer | Evan G. Colgan, James M. E. Harper, Hiroshi Takatsuji | 2002-02-12 |
| 6344129 | Method for plating copper conductors and devices formed | Panayotis Andricacos, Cyril Cabral, Jr., Lynne M. Gignac, Cyprian Emeka Uzoh, Peter S. Locke | 2002-02-05 |
| 6340325 | Polishing pad grooving method and apparatus | Shyng-Tsong Chen, Alex Siu Keung Chung, Kenneth M. Davis, Oscar K. Hsu | 2002-01-22 |