Issued Patents 2002
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6486557 | Hybrid dielectric structure for improving the stiffness of back end of the line structures | Charles R. Davis, Daniel C. Edelstein, John C. Hay, Jr., Christopher V. Jahnes, Vincent J. McGahay +1 more | 2002-11-26 |
| 6455443 | Method of fabricating low-dielectric constant interlevel dielectric films for BEOL interconnects with enhanced adhesion and low-defect density | Andrew Robert Eckert, John C. Hay, Jr., Kang-Wook Lee, Eric G. Liniger, Eva E. Simonyi | 2002-09-24 |
| 6451712 | Method for forming a porous dielectric material layer in a semiconductor device and device formed | Timothy J. Dalton, Stephen E. Greco, Satyanarayana V. Nitta, Sampath Purushothaman, Kenneth P. Rodbell +1 more | 2002-09-17 |
| 6413852 | Method of forming multilevel interconnect structure containing air gaps including utilizing both sacrificial and placeholder material | Alfred Grill, Christopher V. Jahnes, Satyanarayana V. Nitta, Kevin S. Petrarca, Sampath Purushothaman +2 more | 2002-07-02 |
| 6414377 | Low k dielectric materials with inherent copper ion migration barrier | Stephan A. Cohen, Claudius Feger, Jane M. Shaw | 2002-07-02 |