Issued Patents 2002
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6455443 | Method of fabricating low-dielectric constant interlevel dielectric films for BEOL interconnects with enhanced adhesion and low-defect density | Andrew Robert Eckert, John C. Hay, Jr., Jeffrey Hedrick, Kang-Wook Lee, Eric G. Liniger | 2002-09-24 |