KL

Kang-Wook Lee

IBM: 1 patents #1,916 of 5,400Top 40%
📍 Yongin-si, NY: #1 of 3 inventorsTop 35%
Overall (2002): #179,693 of 266,432Top 70%
1
Patents 2002

Issued Patents 2002

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
6455443 Method of fabricating low-dielectric constant interlevel dielectric films for BEOL interconnects with enhanced adhesion and low-defect density Andrew Robert Eckert, John C. Hay, Jr., Jeffrey Hedrick, Eric G. Liniger, Eva E. Simonyi 2002-09-24