Issued Patents 2002
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6486557 | Hybrid dielectric structure for improving the stiffness of back end of the line structures | Charles R. Davis, Daniel C. Edelstein, Jeffrey Hedrick, Christopher V. Jahnes, Vincent J. McGahay +1 more | 2002-11-26 |
| 6455443 | Method of fabricating low-dielectric constant interlevel dielectric films for BEOL interconnects with enhanced adhesion and low-defect density | Andrew Robert Eckert, Jeffrey Hedrick, Kang-Wook Lee, Eric G. Liniger, Eva E. Simonyi | 2002-09-24 |