Issued Patents 2002
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6486557 | Hybrid dielectric structure for improving the stiffness of back end of the line structures | Charles R. Davis, Daniel C. Edelstein, John C. Hay, Jr., Jeffrey Hedrick, Christopher V. Jahnes +1 more | 2002-11-26 |
| 6478212 | Bond pad structure and method for reduced downward force wirebonding | Brett H. Engel, Henry A. Nye, III | 2002-11-12 |
| 6479884 | Interim oxidation of silsesquioxane dielectric for dual damascene process | Robert Cook, Stephen E. Greco, John P. Hummel, Joyce C. Liu, Rebecca D. Mih +1 more | 2002-11-12 |
| 6387754 | Method of forming an on-chip decoupling capacitor with bottom hardmask | Timothy J. Dalton, Andrew P. Cowley, Peter A. Emmi, Erdem Kaltalioglu | 2002-05-14 |
| 6348736 | In situ formation of protective layer on silsesquioxane dielectric for dual damascene process | John P. Hummel, Joyce C. Liu, Rebecca D. Mih, Kamalesh K. Srivastava, Robert Cook +1 more | 2002-02-19 |