Issued Patents 2002
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6486557 | Hybrid dielectric structure for improving the stiffness of back end of the line structures | Charles R. Davis, Daniel C. Edelstein, John C. Hay, Jr., Jeffrey Hedrick, Christopher V. Jahnes +1 more | 2002-11-26 |
| 6478212 | Bond pad structure and method for reduced downward force wirebonding | Brett H. Engel, Vincent J. McGahay | 2002-11-12 |