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Satyanarayana V. Nitta

IBM: 3 patents #556 of 5,400Top 15%
📍 Poughquag, NY: #4 of 10 inventorsTop 40%
🗺 New York: #821 of 9,277 inventorsTop 9%
Overall (2002): #21,471 of 266,432Top 9%
3
Patents 2002

Issued Patents 2002

Showing 1–3 of 3 patents

Patent #TitleCo-InventorsDate
6451712 Method for forming a porous dielectric material layer in a semiconductor device and device formed Timothy J. Dalton, Stephen E. Greco, Jeffrey Hedrick, Sampath Purushothaman, Kenneth P. Rodbell +1 more 2002-09-17
6413852 Method of forming multilevel interconnect structure containing air gaps including utilizing both sacrificial and placeholder material Alfred Grill, Jeffrey Hedrick, Christopher V. Jahnes, Kevin S. Petrarca, Sampath Purushothaman +2 more 2002-07-02
6346484 Method for selective extraction of sacrificial place-holding material used in fabrication of air gap-containing interconnect structures John M. Cotte, Christopher V. Jahnes, Kenneth McCullough, Wayne M. Moreau, Katherine L. Saenger +1 more 2002-02-12