Issued Patents 2002
Showing 1–12 of 12 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6495825 | Apparatus for photo exposure of materials with subsequent capturing of volatiles for analysis | Mark S. Chace, John E. Darney, David R. Medeiros, Alfred Oscar Passano | 2002-12-17 |
| 6479018 | Detection of a gaseous substance emanating from a layer of polymeric composition | James Patrick Collins, Laird MacDowell, Michael Santarelli | 2002-11-12 |
| 6457480 | Process and apparatus for cleaning filters | John M. Cotte, Kenneth McCullough, Keith R. Pope, John P. Simons, Charles J. Taft | 2002-10-01 |
| 6454869 | Process of cleaning semiconductor processing, handling and manufacturing equipment | John M. Cotte, Dario L. Goldfarb, Kenneth McCullough, Keith R. Pope, John P. Simons +1 more | 2002-09-24 |
| 6451375 | Process for depositing a film on a nanometer structure | John M. Cotte, Kenneth McCullough, John P. Simons, Charles J. Taft | 2002-09-17 |
| 6451510 | Developer/rinse formulation to prevent image collapse in resist | Scott A. Messick, Christopher F. Robinson | 2002-09-17 |
| 6425956 | Process for removing chemical mechanical polishing residual slurry | John M. Cotte, Donald J. Delehanty, Kenneth McCullough, John P. Simons, Charles J. Taft +1 more | 2002-07-30 |
| 6420088 | Antireflective silicon-containing compositions as hardmask layer | Marie Angelopoulos, Ari Aviram, C. Richard Guarnieri, Wu-Song Huang, Ranee W. Kwong | 2002-07-16 |
| 6420084 | Mask-making using resist having SIO bond-containing polymer | Marie Angelopoulos, Ari Aviram, C. Richard Guarnieri, Wu-Song Huang, Ranee W. Kwong +3 more | 2002-07-16 |
| 6398875 | Process of drying semiconductor wafers using liquid or supercritical carbon dioxide | John M. Cotte, Dario L. Goldfarb, Kenneth McCullough, Keith R. Pope, John P. Simons +1 more | 2002-06-04 |
| 6383712 | Polymer-bound sensitizer | Premlatha Jagannathan, Leo L. Linehan, Randolph J. Smith | 2002-05-07 |
| 6346484 | Method for selective extraction of sacrificial place-holding material used in fabrication of air gap-containing interconnect structures | John M. Cotte, Christopher V. Jahnes, Kenneth McCullough, Satyanarayana V. Nitta, Katherine L. Saenger +1 more | 2002-02-12 |