Issued Patents 2002
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6448173 | Aluminum-based metallization exhibiting reduced electromigration and method therefor | Lawrence A. Clevenger, Ronald G. Filippi, Kenneth P. Rodbell, Chao-Kun Hu, Lynne M. Gignac +3 more | 2002-09-10 |
| 6444565 | Dual-rie structure for via/line interconnections | Christopher Adam Feild, Rajiv V. Joshi, Edward W. Kiewra | 2002-09-03 |
| 6433436 | Dual-RIE structure for via/line interconnections | Christopher Adam Feild, Rajiv V. Joshi, Edward W. Kiewra | 2002-08-13 |
| 6413866 | Method of forming a solute-enriched layer in a substrate surface and article formed thereby | Horatio S. Wildman, Lawrence A. Clevenger, Chenting Lin, Kenneth P. Rodbell, Stefan Weber +2 more | 2002-07-02 |
| 6383920 | Process of enclosing via for improved reliability in dual damascene interconnects | Ping-Chuan Wang, Ronald G. Filippi, Robert D. Edwards, Edward W. Kiewra | 2002-05-07 |
| 6361880 | CVD/PVD/CVD/PVD fill process | Larry Clevenger, Rainer Florian Schnabel, Stefan Weber | 2002-03-26 |