Issued Patents 2002
Showing 1–13 of 13 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6488823 | Stress tunable tantalum and tantalum nitride films | Tony P. Chiang, Barry Chin, Bingxi Sun | 2002-12-03 |
| 6458255 | Ultra-low resistivity tantalum films and methods for their deposition | Tony P. Chiang, Barry Chin | 2002-10-01 |
| 6458251 | Pressure modulation method to obtain improved step coverage of seed layer | Arvind Sundarrajan, Darryl Angelo, Barry Chin, Imran Hasim | 2002-10-01 |
| 6436267 | Method for achieving copper fill of high aspect ratio interconnect features | Daniel Carl, Barry Chin, Liang-Yuh Chen, Robin Cheung, Yezdi Dordi +3 more | 2002-08-20 |
| 6413383 | Method for igniting a plasma in a sputter reactor | Tony P. Chiang, Yu D. Cong, Jianming Fu, Howard H. Tang, Anish Tolia | 2002-07-02 |
| 6398929 | Plasma reactor and shields generating self-ionized plasma for sputtering | Tony P. Chiang, Yu D. Cong, Jianming Fu, Howard H. Tang, Anish Tolia | 2002-06-04 |
| 6399479 | Processes to improve electroplating fill | Fusen Chen, Zheng Xu, Barry Chin, Ashok Sinha | 2002-06-04 |
| 6387805 | Copper alloy seed layer for copper metallization | Tony P. Chiang, Imran Hashim, Bingxi Sun, Barry Chin | 2002-05-14 |
| 6376807 | Enhanced cooling IMP coil support | Richard Hong, James Tsung, Gunnar Vatvedt, Arvind Sundarrajan | 2002-04-23 |
| 6375743 | Method for improved chamber bake-out and cool-down | Arvind Sundarrajan, Dinesh Saigal | 2002-04-23 |
| 6368880 | Barrier applications for aluminum planarization | Shri Singhvi, Suraj Rengarajan, Gongda Yao | 2002-04-09 |
| 6352926 | Structure for improving low temperature copper reflow in semiconductor features | Imran Hashim, Barry Chin | 2002-03-05 |
| 6350353 | Alternate steps of IMP and sputtering process to improve sidewall coverage | Praburam Gopalraja, Sergio Edelstein, Avi Tepman, Debabrata Ghosh, Nirmalya Maity | 2002-02-26 |