Issued Patents 2002
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6485618 | Integrated copper fill process | Praburam Gopalraja, Jianming Fu, Fusen Chen, Girish Dixit, Sankaram Athreya +2 more | 2002-11-26 |
| 6451179 | Method and apparatus for enhancing sidewall coverage during sputtering in a chamber having an inductively coupled plasma | Gongda Yao | 2002-09-17 |
| 6451177 | Vault shaped target and magnetron operable in two sputtering modes | Praburam Gopalraja, Jianming Fu, Fusen Chen, Girish Dixit, Wei Wang +1 more | 2002-09-17 |
| 6449525 | Computer system to control multiple step ionized metal plasma deposition process for conformal step coverage | Joanna Liu | 2002-09-10 |
| 6413382 | Pulsed sputtering with a small rotating magnetron | Wei Wang, Praburam Gopalraja, Jianming Fu | 2002-07-02 |
| 6409890 | Method and apparatus for forming a uniform layer on a workpiece during sputtering | Howard Grunes, Praburam Gopalraja, John C. Forster, Ralf Hofmann, Anantha K. Subramani | 2002-06-25 |
| 6399479 | Processes to improve electroplating fill | Fusen Chen, Peijun Ding, Barry Chin, Ashok Sinha | 2002-06-04 |
| 6372633 | Method and apparatus for forming metal interconnects | Dan Maydan, Ashok Sinha, Liang Chen, Roderick C. Mosely, Daniel Carl +3 more | 2002-04-16 |
| 6368469 | Coils for generating a plasma and for sputtering | Jaim Nulman, Sergio Edelstein, Mani Subramani, Howard Grunes, Avi Tepman +2 more | 2002-04-09 |