Issued Patents 2002
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6485618 | Integrated copper fill process | Praburam Gopalraja, Jianming Fu, Fusen Chen, Girish Dixit, Zheng Xu +2 more | 2002-11-26 |
| 6451177 | Vault shaped target and magnetron operable in two sputtering modes | Praburam Gopalraja, Jianming Fu, Fusen Chen, Girish Dixit, Zheng Xu +1 more | 2002-09-17 |
| 6436267 | Method for achieving copper fill of high aspect ratio interconnect features | Daniel Carl, Barry Chin, Liang-Yuh Chen, Robin Cheung, Peijun Ding +3 more | 2002-08-20 |
| 6399479 | Processes to improve electroplating fill | Fusen Chen, Zheng Xu, Peijun Ding, Barry Chin | 2002-06-04 |
| 6372633 | Method and apparatus for forming metal interconnects | Dan Maydan, Zheng Xu, Liang Chen, Roderick C. Mosely, Daniel Carl +3 more | 2002-04-16 |