Issued Patents 2002
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6436267 | Method for achieving copper fill of high aspect ratio interconnect features | Barry Chin, Liang-Yuh Chen, Robin Cheung, Peijun Ding, Yezdi Dordi +3 more | 2002-08-20 |
| 6372633 | Method and apparatus for forming metal interconnects | Dan Maydan, Ashok Sinha, Zheng Xu, Liang Chen, Roderick C. Mosely +3 more | 2002-04-16 |
| 6362099 | Method for enhancing the adhesion of copper deposited by chemical vapor deposition | Srinivas Gandikota, Dennis Cong, Liang-Yuh Chen, Sesh Ramaswami | 2002-03-26 |