Issued Patents 2002
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6488823 | Stress tunable tantalum and tantalum nitride films | Tony P. Chiang, Peijun Ding, Bingxi Sun | 2002-12-03 |
| 6458251 | Pressure modulation method to obtain improved step coverage of seed layer | Arvind Sundarrajan, Darryl Angelo, Peijun Ding, Imran Hasim | 2002-10-01 |
| 6458255 | Ultra-low resistivity tantalum films and methods for their deposition | Tony P. Chiang, Peijun Ding | 2002-10-01 |
| 6436267 | Method for achieving copper fill of high aspect ratio interconnect features | Daniel Carl, Liang-Yuh Chen, Robin Cheung, Peijun Ding, Yezdi Dordi +3 more | 2002-08-20 |
| 6399479 | Processes to improve electroplating fill | Fusen Chen, Zheng Xu, Peijun Ding, Ashok Sinha | 2002-06-04 |
| 6387805 | Copper alloy seed layer for copper metallization | Peijun Ding, Tony P. Chiang, Imran Hashim, Bingxi Sun | 2002-05-14 |
| 6352926 | Structure for improving low temperature copper reflow in semiconductor features | Peijun Ding, Imran Hashim | 2002-03-05 |