Issued Patents 2002
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6485618 | Integrated copper fill process | Praburam Gopalraja, Jianming Fu, Girish Dixit, Zheng Xu, Sankaram Athreya +2 more | 2002-11-26 |
| 6451177 | Vault shaped target and magnetron operable in two sputtering modes | Praburam Gopalraja, Jianming Fu, Girish Dixit, Zheng Xu, Wei Wang +1 more | 2002-09-17 |
| 6399479 | Processes to improve electroplating fill | Zheng Xu, Peijun Ding, Barry Chin, Ashok Sinha | 2002-06-04 |
| 6383915 | Tailoring of a wetting/barrier layer to reduce electromigration in an aluminum interconnect | Jingang Su, Gongda Yao, Zhang Xu | 2002-05-07 |
| 6355560 | Low temperature integrated metallization process and apparatus | Roderick C. Mosely, Hong Mei Zhang, Ted Guo | 2002-03-12 |