Issued Patents 2002
Showing 1–13 of 13 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6485618 | Integrated copper fill process | Jianming Fu, Fusen Chen, Girish Dixit, Zheng Xu, Sankaram Athreya +2 more | 2002-11-26 |
| 6485617 | Sputtering method utilizing an extended plasma region | Jianming Fu | 2002-11-26 |
| 6461483 | Method and apparatus for performing high pressure physical vapor deposition | Bradley O. Stimson, John C. Forster, Wei Wang | 2002-10-08 |
| 6451177 | Vault shaped target and magnetron operable in two sputtering modes | Jianming Fu, Fusen Chen, Girish Dixit, Zheng Xu, Wei Wang +1 more | 2002-09-17 |
| 6444104 | Sputtering target having an annular vault | Jianming Fu | 2002-09-03 |
| 6436251 | Vault-shaped target and magnetron having both distributed and localized magnets | Jianming Fu, Wei Wang | 2002-08-20 |
| 6413382 | Pulsed sputtering with a small rotating magnetron | Wei Wang, Jianming Fu, Zheng Xu | 2002-07-02 |
| 6409890 | Method and apparatus for forming a uniform layer on a workpiece during sputtering | Howard Grunes, Zheng Xu, John C. Forster, Ralf Hofmann, Anantha K. Subramani | 2002-06-25 |
| 6406599 | Magnetron with a rotating center magnet for a vault shaped sputtering target | Anantha K. Subramani, Umesh M. Kelkar, Jianming Fu | 2002-06-18 |
| 6368469 | Coils for generating a plasma and for sputtering | Jaim Nulman, Sergio Edelstein, Mani Subramani, Zheng Xu, Howard Grunes +2 more | 2002-04-09 |
| 6358376 | Biased shield in a magnetron sputter reactor | Wei Wang, Jianming Fu | 2002-03-19 |
| 6350353 | Alternate steps of IMP and sputtering process to improve sidewall coverage | Sergio Edelstein, Avi Tepman, Peijun Ding, Debabrata Ghosh, Nirmalya Maity | 2002-02-26 |
| 6344419 | Pulsed-mode RF bias for sidewall coverage improvement | John C. Forster, Bradley O. Stimson, Liubo Hong | 2002-02-05 |