Issued Patents 2002
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6485618 | Integrated copper fill process | Praburam Gopalraja, Jianming Fu, Fusen Chen, Zheng Xu, Sankaram Athreya +2 more | 2002-11-26 |
| 6451177 | Vault shaped target and magnetron operable in two sputtering modes | Praburam Gopalraja, Jianming Fu, Fusen Chen, Zheng Xu, Wei Wang +1 more | 2002-09-17 |
| 6358849 | Integrated circuit interconnect and method | Robert H. Havemann, Manoj Kumar Jain, Eden Zielinski, Qi-Zhong Hong, Jeffrey Alan West | 2002-03-19 |
| 6355558 | Metallization structure, and associated method, to improve crystallographic texture and cavity fill for CVD aluminum/PVD aluminum alloy films | Anthony Konecni | 2002-03-12 |
| 6355559 | Passivation of inlaid metallization | Robert H. Havemann, Qi-Zhong Hong | 2002-03-12 |