Issued Patents 2002
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6500762 | Method of depositing a copper seed layer which promotes improved feature surface coverage | Imran Hashim, Hong Mei Zhang | 2002-12-31 |
| 6461483 | Method and apparatus for performing high pressure physical vapor deposition | Praburam Gopalraja, Bradley O. Stimson, Wei Wang | 2002-10-08 |
| 6409890 | Method and apparatus for forming a uniform layer on a workpiece during sputtering | Howard Grunes, Zheng Xu, Praburam Gopalraja, Ralf Hofmann, Anantha K. Subramani | 2002-06-25 |
| 6391776 | Method of depositing a copper seed layer which promotes improved feature surface coverage | Imran Hashim, Hong Mei Zhang | 2002-05-21 |
| 6368469 | Coils for generating a plasma and for sputtering | Jaim Nulman, Sergio Edelstein, Mani Subramani, Zheng Xu, Howard Grunes +2 more | 2002-04-09 |
| 6344419 | Pulsed-mode RF bias for sidewall coverage improvement | Praburam Gopalraja, Bradley O. Stimson, Liubo Hong | 2002-02-05 |