HZ

Hong Mei Zhang

Applied Materials: 4 patents #82 of 912Top 9%
📍 Beijing, CA: #11 of 103 inventorsTop 15%
Overall (2002): #15,582 of 266,432Top 6%
4
Patents 2002

Issued Patents 2002

Showing 1–4 of 4 patents

Patent #TitleCo-InventorsDate
6500762 Method of depositing a copper seed layer which promotes improved feature surface coverage Imran Hashim, John C. Forster 2002-12-31
6436819 Nitrogen treatment of a metal nitride/metal stack Zhi ZHANG, David Pung, Nitin Khurana, Roderick C. Mosely 2002-08-20
6391776 Method of depositing a copper seed layer which promotes improved feature surface coverage Imran Hashim, John C. Forster 2002-05-21
6355560 Low temperature integrated metallization process and apparatus Roderick C. Mosely, Fusen Chen, Ted Guo 2002-03-12