Issued Patents 2002
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6500762 | Method of depositing a copper seed layer which promotes improved feature surface coverage | Hong Mei Zhang, John C. Forster | 2002-12-31 |
| 6436267 | Method for achieving copper fill of high aspect ratio interconnect features | Daniel Carl, Barry Chin, Liang-Yuh Chen, Robin Cheung, Peijun Ding +3 more | 2002-08-20 |
| 6391776 | Method of depositing a copper seed layer which promotes improved feature surface coverage | Hong Mei Zhang, John C. Forster | 2002-05-21 |
| 6387805 | Copper alloy seed layer for copper metallization | Peijun Ding, Tony P. Chiang, Bingxi Sun, Barry Chin | 2002-05-14 |
| 6352926 | Structure for improving low temperature copper reflow in semiconductor features | Peijun Ding, Barry Chin | 2002-03-05 |