Issued Patents 2002
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6458684 | Single step process for blanket-selective CVD aluminum deposition | Ted Guo, Mehul Naik, Roderick C. Mosely | 2002-10-01 |
| 6436267 | Method for achieving copper fill of high aspect ratio interconnect features | Daniel Carl, Barry Chin, Robin Cheung, Peijun Ding, Yezdi Dordi +3 more | 2002-08-20 |
| 6430458 | Semi-selective chemical vapor deposition | Roderick C. Mosely, Ted Guo | 2002-08-06 |
| 6362099 | Method for enhancing the adhesion of copper deposited by chemical vapor deposition | Srinivas Gandikota, Dennis Cong, Sesh Ramaswami, Daniel Carl | 2002-03-26 |