Issued Patents 2002
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6362099 | Method for enhancing the adhesion of copper deposited by chemical vapor deposition | Dennis Cong, Liang-Yuh Chen, Sesh Ramaswami, Daniel Carl | 2002-03-26 |
SG
Srinivas Gandikota
Overall (2002): #115,299 of 266,432Top 45%
1
Patents 2002