Issued Patents 2002
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6362099 | Method for enhancing the adhesion of copper deposited by chemical vapor deposition | Srinivas Gandikota, Dennis Cong, Liang-Yuh Chen, Daniel Carl | 2002-03-26 |
SR
Sesh Ramaswami
Overall (2002): #120,024 of 266,432Top 50%
1
Patents 2002