Issued Patents 2002
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6494219 | Apparatus with etchant mixing assembly for removal of unwanted electroplating deposits | Radha Nayak, Joseph Stevens, Peter Hey | 2002-12-17 |
| 6436267 | Method for achieving copper fill of high aspect ratio interconnect features | Daniel Carl, Barry Chin, Liang-Yuh Chen, Robin Cheung, Peijun Ding +3 more | 2002-08-20 |
| 6423636 | Process sequence for improved seed layer productivity and achieving 3mm edge exclusion for a copper metalization process on semiconductor wafer | Michael Sugarman | 2002-07-23 |
| 6416647 | Electro-chemical deposition cell for face-up processing of single semiconductor substrates | Joe Stevens, Roy Edwards, Bob Lowrance, Michael Sugarman, Mark Denome | 2002-07-09 |