Issued Patents 2002
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6492722 | Metallized interconnection structure | Chiu H. Ting | 2002-12-10 |
| 6477787 | Method and apparatus for heating and cooling substrates | Ratson Morad, Ho Seon Shin, Igor Kogan | 2002-11-12 |
| 6455415 | Method of encapsulated copper (Cu) interconnect formation | Sergey Lopatin | 2002-09-24 |
| 6436267 | Method for achieving copper fill of high aspect ratio interconnect features | Daniel Carl, Barry Chin, Liang-Yuh Chen, Peijun Ding, Yezdi Dordi +3 more | 2002-08-20 |
| 6400030 | Self-aligning vias for semiconductors | Fei Wang, Mark S. Chang, Richard J. Huang, Angela T. Hui | 2002-06-04 |
| 6357143 | Method and apparatus for heating and cooling substrates | Ratson Morad, Ho Seon Shin, Igor Kogan | 2002-03-19 |