Issued Patents 2002
Showing 1–17 of 17 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6495443 | Method of re-working copper damascene wafers | Sergey Lopatin | 2002-12-17 |
| 6492258 | METHOD FOR REDUCING STRESS-INDUCED VOIDS FOR 0.25-&mgr;M AND SMALLER SEMICONDUCTOR CHIP TECHNOLOGY BY ANNEALING INTERCONNECT LINES AND USING LOW BIAS VOLTAGE AND LOW INTERLAYER DIELECTRIC DEPOSITION RATE AND SEMICONDUCTOR CHIP MADE THEREBY | Minh Van Ngo, Paul R. Besser, Matthew S. Buynoski, John Caffall, Nick Maccrae +1 more | 2002-12-10 |
| 6489230 | Integration of low-k SiOF as inter-layer dielectric | — | 2002-12-03 |
| 6472336 | Forming an encapsulating layer after deposition of a dielectric comprised of corrosive material | Suzette K. Pangrle, Minh Van Ngo | 2002-10-29 |
| 6444593 | Surface treatment of low-K SiOF to prevent metal interaction | Minh Van Ngo, Guarionex Morales | 2002-09-03 |
| 6429108 | Non-volatile memory device with encapsulated tungsten gate and method of making same | Chi Chang, Keizaburo Yoshie, Yu Sun | 2002-08-06 |
| 6429121 | Method of fabricating dual damascene with silicon carbide via mask/ARC | Dawn Hopper, Ramkumar Subramanian | 2002-08-06 |
| 6420278 | Method for improving the dielectric constant of silicon-based semiconductor materials | Dawn Hopper, Lu You | 2002-07-16 |
| 6407009 | Methods of manufacture of uniform spin-on films | Lu You, Dawn Hopper | 2002-06-18 |
| 6400030 | Self-aligning vias for semiconductors | Fei Wang, Robin Cheung, Mark S. Chang, Angela T. Hui | 2002-06-04 |
| 6400023 | Integration of low-k SiOF for damascene structure | — | 2002-06-04 |
| 6388309 | Apparatus and method for manufacturing semiconductors using low dielectric constant materials | Lu You, Dawn Hopper | 2002-05-14 |
| 6387825 | Solution flow-in for uniform deposition of spin-on films | Lu You, Dawn Hopper | 2002-05-14 |
| 6361837 | Method and system for modifying and densifying a porous film | Suzette K. Pangrle, Shekhar Pramanick | 2002-03-26 |
| 6355546 | Thermally grown protective oxide buffer layer for ARC removal | Lewis Shen | 2002-03-12 |
| 6346467 | Method of making tungsten gate MOS transistor and memory cell by encapsulating | Chi Chang, Keizaburo Yoshie, Yu Sun | 2002-02-12 |
| 6335273 | Surface treatment of low-K SiOF to prevent metal interaction | Guarionex Morales, Simon S. Chan | 2002-01-01 |