Issued Patents 2002
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6472317 | Dual damascene arrangement for metal interconnection with low k dielectric constant materials in dielectric layers | Fei Wang, Jerry Cheng, Todd P. Lukanc | 2002-10-29 |
| 6417571 | Single grain copper interconnect with bamboo structure in a trench | Takeshi Nogami | 2002-07-09 |
| 6368949 | Post-spacer etch surface treatment for improved silicide formation | Susan H. Chen | 2002-04-09 |
| 6355575 | Semiconductor device and method of manufacturing without damaging HSQ layer and metal pattern | Fei Wang, Susan H. Chen | 2002-03-12 |
| 6335273 | Surface treatment of low-K SiOF to prevent metal interaction | Richard J. Huang, Guarionex Morales | 2002-01-01 |