Issued Patents 2002
Showing 1–15 of 15 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6492266 | Method of forming reliable capped copper interconnects | Minh Van Ngo, Shekhar Pramanick | 2002-12-10 |
| 6479384 | Process for fabricating a semiconductor device | Naoki Komai, Yuji Segawa | 2002-11-12 |
| 6472755 | Semiconductor device comprising copper interconnects with reduced in-line copper diffusion | Minh Van Ngo | 2002-10-29 |
| 6465345 | Prevention of inter-channel current leakage in semiconductors | Shekhar Pramanick | 2002-10-15 |
| 6417571 | Single grain copper interconnect with bamboo structure in a trench | Simon S. Chan | 2002-07-09 |
| 6399505 | Method and system for copper interconnect formation | — | 2002-06-04 |
| 6395627 | Semiconductor device a burried wiring structure and process for fabricating the same | Kazuhiro Hoshino | 2002-05-28 |
| 6380625 | Semiconductor interconnect barrier and manufacturing method thereof | Shekhar Pramanick | 2002-04-30 |
| 6380556 | Test structure used to measure metal bottom coverage in trenches and vias/contacts and method for creating the test structure | David Bang, Guarionex Morales, Shekhar Pramanick | 2002-04-30 |
| 6368961 | Graded compound seed layers for semiconductors | Sergey Lopatin | 2002-04-09 |
| 6368954 | Method of copper interconnect formation using atomic layer copper deposition | Sergey Lopatin, Carl Galewski | 2002-04-09 |
| 6362100 | Methods and apparatus for forming a copper interconnect | Axel Preusse, Valery M. Dubin | 2002-03-26 |
| 6346745 | Cu-A1 combined interconnect system | Susan H. Chen | 2002-02-12 |
| 6346470 | Method for reducing electromigration in semiconductor interconnect lines | Sergey Lopatin | 2002-02-12 |
| 6335283 | Method of reducing in-line copper diffusion | Minh Van Ngo | 2002-01-01 |