Issued Patents 2002
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6472317 | Dual damascene arrangement for metal interconnection with low k dielectric constant materials in dielectric layers | Fei Wang, Simon S. Chan, Todd P. Lukanc | 2002-10-29 |
| 6380091 | Dual damascene arrangement for metal interconnection with oxide dielectric layer and low K dielectric constant layer | Fei Wang, Darrell M. Erb | 2002-04-30 |