Issued Patents 2002
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6500754 | Anneal hillock suppression method in integrated circuit interconnects | Steven C. Avanzino, Alline F. Myers | 2002-12-31 |
| 6465889 | Silicon carbide barc in dual damascene processing | Ramkumar Subramanian, Fei Wang, Lynne A. Okada, Calvin T. Gabriel | 2002-10-15 |
| 6454916 | Selective electroplating with direct contact chemical polishing | Fei Wang, Steven C. Avanzino | 2002-09-24 |
| 6455425 | Selective deposition process for passivating top interface of damascene-type Cu interconnect lines | Paul R. Besser, Sergey Lopatin | 2002-09-24 |
| 6444567 | Process for alloying damascene-type Cu interconnect lines | Paul R. Besser | 2002-09-03 |
| 6383947 | Anti-reflective coating used in the fabrication of microcircuit structures in 0.18 micron and smaller technologies | Paul R. Besser, Bhanwar Singh, Susan H. Chen, Carmen Morales | 2002-05-07 |
| 6380091 | Dual damascene arrangement for metal interconnection with oxide dielectric layer and low K dielectric constant layer | Fei Wang, Jerry Cheng | 2002-04-30 |