Issued Patents 2002
Showing 1–16 of 16 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6495447 | Use of hydrogen doping for protection of low-k dielectric layers | Calvin T. Gabriel | 2002-12-17 |
| 6492272 | Carrier gas modification for use in plasma ashing of photoresist | Fei Wang | 2002-12-10 |
| 6475929 | Method of manufacturing a semiconductor structure with treatment to sacrificial stop layer producing diffusion to an adjacent low-k dielectric layer lowering the constant | Calvin T. Gabriel, Suzette K. Pangrle, Fei Wang | 2002-11-05 |
| 6472231 | Dielectric layer with treated top surface forming an etch stop layer and method of making the same | Calvin T. Gabriel | 2002-10-29 |
| 6465889 | Silicon carbide barc in dual damascene processing | Ramkumar Subramanian, Fei Wang, Calvin T. Gabriel, Darrell M. Erb | 2002-10-15 |
| 6465340 | Via filled dual damascene structure with middle stop layer and method for making the same | Fei Wang, Ramkumar Subramanian, Calvin T. Gabriel | 2002-10-15 |
| 6451673 | Carrier gas modification for preservation of mask layer during plasma etching | Calvin T. Gabriel | 2002-09-17 |
| 6448654 | Ultra thin etch stop layer for damascene process | Calvin T. Gabriel | 2002-09-10 |
| 6444573 | Method of making a slot via filled dual damascene structure with a middle stop layer | Fei Wang, Ramkumar Subramanian, Calvin T. Gabriel | 2002-09-03 |
| 6429116 | Method of fabricating a slot dual damascene structure without middle stop layer | Fei Wang, Ramkumar Subramanian, Calvin T. Gabriel | 2002-08-06 |
| 6391766 | Method of making a slot via filled dual damascene structure with middle stop layer | Fei Wang, Ramkumar Subramanian, Calvin T. Gabriel | 2002-05-21 |
| 6383919 | Method of making a dual damascene structure without middle stop layer | Fei Wang, Ramkumar Subramanian, Calvin T. Gabriel | 2002-05-07 |
| 6372631 | Method of making a via filled dual damascene structure without middle stop layer | Fei Wang, Ramkumar Subramanian, Calvin T. Gabriel | 2002-04-16 |
| 6372635 | Method for making a slot via filled dual damascene low k interconnect structure without middle stop layer | Fei Wang, Ramkumar Subramanian, Calvin T. Gabriel | 2002-04-16 |
| 6365505 | Method of making a slot via filled dual damascene structure with middle stop layer | Fei Wang, Ramkumar Subramanian, Calvin T. Gabriel | 2002-04-02 |
| 6340395 | Salsa clean process | Jacques Bertrand, Barry Earl Dick, Shu Tsai Wang, Weiwen Ou, Yen-Chia Chu | 2002-01-22 |