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Matthew S. Buynoski

AM AMD: 24 patents #10 of 1,128Top 1%
📍 Palo Alto, CA: #2 of 925 inventorsTop 1%
🗺 California: #24 of 26,763 inventorsTop 1%
Overall (2002): #152 of 266,432Top 1%
24
Patents 2002

Issued Patents 2002

Showing 1–24 of 24 patents

Patent #TitleCo-InventorsDate
6500743 Method of copper-polysilicon T-gate formation Sergey Lopatin, Steven C. Avanzino 2002-12-31
6495887 Argon implantation after silicidation for improved floating-body effects Srinath Krishnan, Witold P. Maszara 2002-12-17
6492249 High-K gate dielectric process with process with self aligned damascene contact to damascene gate and a low-k inter level dielectric Qi Xiang, Ming-Ren Lin 2002-12-10
6492209 Selectively thin silicon film for creating fully and partially depleted SOI on same wafer Srinath Krishnan, Witold P. Maszara 2002-12-10
6492258 METHOD FOR REDUCING STRESS-INDUCED VOIDS FOR 0.25-&mgr;M AND SMALLER SEMICONDUCTOR CHIP TECHNOLOGY BY ANNEALING INTERCONNECT LINES AND USING LOW BIAS VOLTAGE AND LOW INTERLAYER DIELECTRIC DEPOSITION RATE AND SEMICONDUCTOR CHIP MADE THEREBY Minh Van Ngo, Paul R. Besser, John Caffall, Nick Maccrae, Richard J. Huang +1 more 2002-12-10
6486062 Selective deposition of amorphous silicon for formation of nickel silicide with smooth interface on N-doped substrate George Jonathan Kluth 2002-11-26
6475874 Damascene NiSi metal gate high-k transistor Qi Xiang, Paul R. Besser, John Foster, Paul L. King, Eric N. Paton 2002-11-05
6465334 Enhanced electroless deposition of dielectric precursor materials for use in in-laid gate MOS transistors Paul R. Besser, Paul L. King, Eric N. Paton, Qi Xiang 2002-10-15
6465309 Silicide gate transistors Qi Xiang, Paul R. Besser, John Foster, Paul L. King, Eric N. Paton 2002-10-15
6458679 Method of making silicide stop layer in a damascene semiconductor structure Eric N. Paton, Paul R. Besser, Qi Xiang, Paul L. King, John Foster 2002-10-01
6452250 Stacked integrated circuit and capacitor structure containing via structures 2002-09-17
6440868 Metal gate with CVD amorphous silicon layer and silicide for CMOS devices and method of making with a replacement gate process Paul R. Besser, Qi Xiang 2002-08-27
6440867 Metal gate with PVD amorphous silicon and silicide for CMOS devices and method of making the same with a replacement gate process Paul R. Besser, Qi Xiang 2002-08-27
6436840 Metal gate with CVD amorphous silicon layer and a barrier layer for CMOS devices and method of making with a replacement gate process Paul R. Besser, Qi Xiang 2002-08-20
6433379 Tantalum anodization for in-laid copper metallization capacitor Sergey Lopatin, Steven C. Avanzino, Qi Xiang 2002-08-13
6417030 Leaky lower interface for reduction of floating body effect in SOI devices Donald L. Wollesen 2002-07-09
6403492 Method of manufacturing semiconductor devices with trench isolation Darin A. Chan 2002-06-11
6396108 Self-aligned double gate silicon-on-insulator (SOI) device Zoran Krivokapic 2002-05-28
6392280 Metal gate with PVD amorphous silicon layer for CMOS devices and method of making with a replacement gate process Paul R. Besser, Qi Xiang 2002-05-21
6380057 Enhancement of nickel silicide formation by use of nickel pre-amorphizing implant George Jonathan Kluth, Paul R. Besser, Paul L. King 2002-04-30
6376343 Reduction of metal silicide/silicon interface roughness by dopant implantation processing Paul R. Besser, Qi Xiang 2002-04-23
6376336 Frontside SOI gettering with phosphorus doping 2002-04-23
6368950 Silicide gate transistors Qi Xiang, Paul R. Besser, John Foster, Paul L. King, Eric N. Paton 2002-04-09
6342414 Damascene NiSi metal gate high-k transistor Qi Xiang, Paul R. Besser, John Foster, Paul L. King, Eric N. Paton 2002-01-29