Issued Patents 2002
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6492722 | Metallized interconnection structure | Robin Cheung | 2002-12-10 |
| 6402592 | Electrochemical methods for polishing copper films on semiconductor substrates | Mei Zhu, Igor Ivanov | 2002-06-11 |
| 6365025 | Method for depositing and/or removing material on a substrate | William H. Holtkamp | 2002-04-02 |