Issued Patents 2002
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6488823 | Stress tunable tantalum and tantalum nitride films | Peijun Ding, Barry Chin, Bingxi Sun | 2002-12-03 |
| 6458255 | Ultra-low resistivity tantalum films and methods for their deposition | Peijun Ding, Barry Chin | 2002-10-01 |
| 6428859 | Sequential method for depositing a film by modulated ion-induced atomic layer deposition (MII-ALD) | Karl Leeser | 2002-08-06 |
| 6416822 | Continuous method for depositing a film by modulated ion-induced atomic layer deposition (MII-ALD) | Karl Leeser | 2002-07-09 |
| 6413383 | Method for igniting a plasma in a sputter reactor | Yu D. Cong, Peijun Ding, Jianming Fu, Howard H. Tang, Anish Tolia | 2002-07-02 |
| 6398929 | Plasma reactor and shields generating self-ionized plasma for sputtering | Yu D. Cong, Peijun Ding, Jianming Fu, Howard H. Tang, Anish Tolia | 2002-06-04 |
| 6387805 | Copper alloy seed layer for copper metallization | Peijun Ding, Imran Hashim, Bingxi Sun, Barry Chin | 2002-05-14 |