YT

Yoshifumi Tahara

TL Tokyo Electron Limited: 20 patents #275 of 5,567Top 5%
KT Kabushiki Kaisha Toshiba: 2 patents #9,982 of 21,451Top 50%
TL Tokyo Electron Yamanashi Limited: 2 patents #21 of 138Top 20%
AC Advantest America R&D Center: 1 patents #4 of 8Top 50%
Sumitomo Electric Industries: 1 patents #13,249 of 21,551Top 65%
📍 Yamato, CA: #1 of 2 inventorsTop 50%
Overall (All Time): #211,447 of 4,157,543Top 6%
21
Patents All Time

Issued Patents All Time

Showing 1–21 of 21 patents

Patent #TitleCo-InventorsDate
7209851 Method and structure to develop a test program for semiconductor integrated circuits Harsanjeet Singh, Ankan Pramanick, Mark Elston, Toshiaki Adachi 2007-04-24
6423242 Etching method Masayuki Kojima, Masayuki Tomoyasu, Akira Koshiishi 2002-07-23
6110287 Plasma processing method and plasma processing apparatus Izumi Arai, Hiroshi Nishikawa, Yoshinobu MITANO, Shunichi Iimuro, Kazuo Fukasawa +2 more 2000-08-29
5858258 Plasma processing method Hiroshi Kojima, Izumi Arai 1999-01-12
5705081 Etching method Koichiro Inazawa, Shin Okamoto 1998-01-06
5698070 Method of etching film formed on semiconductor wafer Yoshihisa Hirano, Hiroshi Nishikawa, Isahiro Hasegawa, Keiji Horioka 1997-12-16
5571366 Plasma processing apparatus Nobuo Ishii, Jiro Hata, Chishio Koshimizu, Hiroshi Nishikawa, Isei Imahashi 1996-11-05
5494522 Plasma process system and method Shuji Moriya, Masahiro Ogasawara, Jun Yashiro, Satoru Kawakami, Susumu Tanaka 1996-02-27
5449977 Apparatus and method for generating plasma of uniform flux density Satoshi Nakagawa, Masahiro Ogasawara 1995-09-12
5411631 Dry etching method Masaru Hori, Haruo Okano, Michishige Aoyama, Masao Ito, Kei Hattori +1 more 1995-05-02
5382311 Stage having electrostatic chuck and plasma processing apparatus using same Kenji Ishikawa, Mitsuaki Komino, Tadashi Mitui, Teruo Iwata, Izumi Arai 1995-01-17
5356515 Dry etching method Yoshihisa Hirano, Masahiro Ogasawara, Isahiro Hasegawa, Keiji Horioka, Takaya Matsushita 1994-10-18
5302236 Method of etching object to be processed including oxide or nitride portion Yoshihisa Hirano, Isahiro Hasegawa, Keiji Horioka 1994-04-12
5270266 Method of adjusting the temperature of a semiconductor wafer Yoshihisa Hirano, Isahiro Hasegawa, Keiji Horioka 1993-12-14
5203958 Processing method and apparatus Izumi Arai 1993-04-20
5164034 Apparatus and method for processing substrate Izumi Arai, Yoshio Ishikawa 1992-11-17
5155331 Method for cooling a plasma electrode system for an etching apparatus Takao Horiuchi, Izumi Arai 1992-10-13
5089083 Plasma etching method Hiroshi Kojima, Izumi Arai 1992-02-18
4978412 Plasma processing device Makoto Aoki, Izumi Arai 1990-12-18
4963713 Cooling of a plasma electrode system for an etching apparatus Takao Horiuchi, Izumi Arai 1990-10-16
4931135 Etching method and etching apparatus Takao Horiuchi, Izumi Arai 1990-06-05