Issued Patents All Time
Showing 26–50 of 68 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9540733 | Film forming method, film forming apparatus and recording medium | — | 2017-01-10 |
| 9425093 | Copper wiring forming method, film forming system, and storage medium | Takashi Sakuma, Osamu Yokoyama, Kai-Hung Yu | 2016-08-23 |
| 9406558 | Cu wiring fabrication method and storage medium | Tatsuo Hirasawa, Takashi Sakuma, Osamu Yokoyama | 2016-08-02 |
| 9406557 | Copper wiring forming method with Ru liner and Cu alloy fill | Osamu Yokoyama, Cheonsoo Han, Takashi Sakuma, Chiaki Yasumuro, Tatsuo Hirasawa +1 more | 2016-08-02 |
| 9368418 | Copper wiring structure forming method | Kenji Suzuki | 2016-06-14 |
| 9362166 | Method of forming copper wiring | Takashi Sakuma, Osamu Yokoyama, Kenji Matsumoto, Peng Chang, Hiroyuki Nagai | 2016-06-07 |
| 9313895 | Method for forming copper wiring | Kenji Suzuki, Atsushi Shimada | 2016-04-12 |
| 9101067 | Method for forming copper wiring | Toshio Hasegawa | 2015-08-04 |
| 9064690 | Method for forming Cu wiring | Atsushi Gomi, Kenji Suzuki, Tatsuo Hatano, Hiroyuki Toshima, Yasushi Mizusawa | 2015-06-23 |
| 8999841 | Semiconductor device manufacturing method | Atsushi Gomi, Kenzi Suzuki, Tatsuo Hatano, Yasushi Mizusawa | 2015-04-07 |
| 8974868 | Post deposition plasma cleaning system and method | Audunn Ludviksson | 2015-03-10 |
| 8859422 | Method of forming copper wiring and method and system for forming copper film | Atsushi Gomi, Takara Kato, Osamu Yokoyama, Takashi Sakuma, Chiaki Yasumuro +5 more | 2014-10-14 |
| 8716132 | Radiation-assisted selective deposition of metal-containing cap layers | Shigeru Mizuno | 2014-05-06 |
| 8399353 | Methods of forming copper wiring and copper film, and film forming system | Atsushi Gomi, Takara Kato, Osamu Yokoyama, Takashi Sakuma, Chiaki Yasumuro +4 more | 2013-03-19 |
| 8372739 | Diffusion barrier for integrated circuits formed from a layer of reactive metal and method of fabrication | Satohiko Hoshino, Kuzuhiro Hamamoto, Shigeru Mizuno, Yasushi Mizusawa | 2013-02-12 |
| 8242019 | Selective deposition of metal-containing cap layers for semiconductor devices | Shigeru Mizuno, Satohiko Hoshino, Hiroyuki Nagai, Yuki Chiba, Frank M. Cerio, Jr. | 2012-08-14 |
| 8075698 | Substrate processing unit, method of detecting end point of cleaning of substrate processing unit, and method of detecting end point of substrate processing | Hiroshi Kannan, Yasuhiko Kojima, Yasuhiro Oshima, Takashi Shigeoka | 2011-12-13 |
| 8058728 | Diffusion barrier and adhesion layer for an interconnect structure | Shigeru Mizuno | 2011-11-15 |
| 8034406 | Integrated substrate processing in a vacuum processing tool | Masamichi Hara, Yasushi Mizusawa | 2011-10-11 |
| 8026168 | Semiconductor device containing an aluminum tantalum carbonitride barrier film and method of forming | Shigeru Mizuno | 2011-09-27 |
| 7989353 | Method for in-situ refurbishing a ceramic substrate holder | Kentaro Asakura, Masanao Ando, Toshio Hasegawa | 2011-08-02 |
| 7977235 | Method for manufacturing a semiconductor device with metal-containing cap layers | — | 2011-07-12 |
| 7959985 | Method of integrating PEALD Ta-containing films into Cu metallization | Tsukasa Matsuda, Masamichi Hara, Jacques Faguet, Yasushi Mizusawa | 2011-06-14 |
| 7884012 | Void-free copper filling of recessed features for semiconductor devices | Kenji Suzuki, Miho Jomen, Jonathan Rullan | 2011-02-08 |
| 7846841 | Method for forming cobalt nitride cap layers | Shigeru Mizuno, Miho Jomen | 2010-12-07 |