TI

Tadahiro Ishizaka

TL Tokyo Electron Limited: 68 patents #26 of 5,567Top 1%
📍 Nirasaki, NY: #1 of 7 inventorsTop 15%
Overall (All Time): #30,614 of 4,157,543Top 1%
68
Patents All Time

Issued Patents All Time

Showing 51–68 of 68 patents

Patent #TitleCo-InventorsDate
7829158 Method for depositing a barrier layer on a low dielectric constant material 2010-11-09
7799681 Method for forming a ruthenium metal cap layer Kenji Suzuki, Frank M. Cerio, Jr., Miho Jomen, Shigeru Mizuno, Yasushi Mizusawa 2010-09-21
7772111 Substrate processing method and fabrication process of a semiconductor device Taro Ikeda, Masamichi Hara 2010-08-10
7727912 Method of light enhanced atomic layer deposition Frank M. Cerio, Jr., Jacques Faguet 2010-06-01
7727883 Method of forming a diffusion barrier and adhesion layer for an interconnect structure Shigeru Mizuno 2010-06-01
7717061 Gas switching mechanism for plasma processing apparatus Naoki Yoshii, Kohei Kawamura, Yukio Fukuda, Takashi Shigeoka, Yasuhiko Kojima +3 more 2010-05-18
7718527 Method for forming cobalt tungsten cap layers Shigeru Mizuno, Miho Jomen 2010-05-18
7708835 Film precursor tray for use in a film precursor evaporation system and method of using Kenji Suzuki, Emmanuel Guidotti, Gerrit J. Leusink, Masamichi Hara, Daisuke Kuroiwa 2010-05-04
7651568 Plasma enhanced atomic layer deposition system Tsukasa Matsuda, Frank M. Cerio, Jr., Kaoru Yamamoto 2010-01-26
7645484 Method of forming a metal carbide or metal carbonitride film having improved adhesion 2010-01-12
7592257 Semiconductor contact structure containing an oxidation-resistant diffusion barrier and method of forming 2009-09-22
7491430 Deposition method for forming a film including metal, nitrogen and carbon Atsushi Gomi, Tatsuo Hatano 2009-02-17
7422636 Plasma enhanced atomic layer deposition system having reduced contamination 2008-09-09
7407876 Method of plasma enhanced atomic layer deposition of TaC and TaCN films having good adhesion to copper 2008-08-05
7338901 Method of preparing a film layer-by-layer using plasma enhanced atomic layer deposition 2008-03-04
7332426 Substrate processing method and fabrication process of a semiconductor device Taro Ikeda, Masamichi Hara 2008-02-19
7314835 Plasma enhanced atomic layer deposition system and method Kaoru Yamamoto 2008-01-01
6991684 Heat-treating apparatus and heat-treating method Hiroshi Kannan, Noboru Tamura, Yasuhiko Kojima 2006-01-31