Issued Patents All Time
Showing 326–350 of 636 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8980693 | Stackable microelectronic package structures | Kyong-Mo Bang | 2015-03-17 |
| 8981547 | Stub minimization for multi-die wirebond assemblies with parallel windows | Richard Dewitt Crisp, Wael Zohni, Frank Lambrecht | 2015-03-17 |
| 8981579 | Impedance controlled packages with metal sheet or 2-layer rdl | Ellis Chau, Wael Zohni, Philip Damberg, Richard Dewitt Crisp | 2015-03-17 |
| 8975738 | Structure for microelectronic packaging with terminals on dielectric mass | Ilyas Mohammed | 2015-03-10 |
| 8975751 | Vias in porous substrates | Ilyas Mohammed, Cyprian Emeka Uzoh, Piyush Savalia | 2015-03-10 |
| 8957527 | Microelectronic package with terminals on dielectric mass | — | 2015-02-17 |
| 8957520 | Microelectronic assembly comprising dielectric structures with different young modulus and having reduced mechanical stresses between the device terminals and external contacts | Hiroaki Sato, Yukio Hashimoto, Yoshikuni Nakadaira, Norihito Masuda, Ilyas Mohammed +1 more | 2015-02-17 |
| 8956916 | Multi-chip module with stacked face-down connected dies | Ilyas Mohammed, Piyush Savalia | 2015-02-17 |
| 8952516 | Multiple die stacking for two or more die | Wael Zohni | 2015-02-10 |
| 8945987 | Manufacture of face-down microelectronic packages | Richard Dewitt Crisp, Wael Zohni | 2015-02-03 |
| 8941999 | Enhanced stacked microelectronic assemblies with central contacts and improved thermal characteristics | Wael Zohni, Richard Dewitt Crisp | 2015-01-27 |
| 8937361 | BSI image sensor package with variable-height silicon for even reception of different wavelengths | Vage Oganesian, Ilyas Mohammed, Piyush Savalia, Craig Mitchell | 2015-01-20 |
| 8928153 | Flip-chip, face-up and face-down centerbond memory wirebond assemblies | Richard Dewitt Crisp, Wael Zohni | 2015-01-06 |
| 8927337 | Stacked packaging improvements | Craig Mitchell, Masud Beroz | 2015-01-06 |
| 8916781 | Cavities containing multi-wiring structures and devices | Ilyas Mohammed, Craig Mitchell, Cyprian Emeka Uzoh | 2014-12-23 |
| 8907466 | Stackable molded microelectronic packages | — | 2014-12-09 |
| 8907500 | Multi-die wirebond packages with elongated windows | Wael Zohni | 2014-12-09 |
| 8900464 | Method of making a microelectronic interconnect element with decreased conductor spacing | Chang Myung Ryu, Kimitaka Endo, Yoichi Kubota | 2014-12-02 |
| 8890327 | Stacked microelectronic packages having at least two stacked microelectronic elements adjacent one another | Ilyas Mohammed | 2014-11-18 |
| 8890304 | Fan-out microelectronic unit WLP having interconnects comprising a matrix of a high melting point, a low melting point and a polymer material | Hiroaki Sato, Kiyoaki Hashimoto, Yoshikuni Nakadaira, Norihito Masuda, Ilyas Mohammed +1 more | 2014-11-18 |
| 8883562 | Reconstituted wafer stack packaging with after-applied pad extensions | Giles Humpston, David Ovrutsky, Laura Wills Mirkarimi | 2014-11-11 |
| 8885356 | Enhanced stacked microelectronic assemblies with central contacts and improved ground or power distribution | Wael Zohni, Richard Dewitt Crisp | 2014-11-11 |
| 8884432 | Substrate and assembly thereof with dielectric removal for increased post height | Kazuo Sakuma, Philip Damberg | 2014-11-11 |
| 8883563 | Fabrication of microelectronic assemblies having stack terminals coupled by connectors extending through encapsulation | Ilyas Mohammed | 2014-11-11 |
| 8878353 | Structure for microelectronic packaging with bond elements to encapsulation surface | Ilyas Mohammed, Terrence Caskey, Reynaldo Co, Ellis Chau | 2014-11-04 |