Issued Patents All Time
Showing 301–325 of 636 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9105612 | Microelectronic packages having cavities for receiving microelectronic elements | Ilyas Mohammed, Wael Zohni, Philip R. Osborn | 2015-08-11 |
| 9099479 | Carrier structures for microelectronic elements | Vage Oganesian, Craig Mitchell, Ilyas Mohammed, Piyush Savalia | 2015-08-04 |
| 9099296 | Stacked microelectronic assembly with TSVS formed in stages with plural active chips | Vage Oganesian, Ilyas Mohammed, Craig Mitchell, Piyush Savalia | 2015-08-04 |
| 9093435 | Package-on-package assembly with wire bonds to encapsulation surface | Hiroaki Sato, Teck-Gyu Kang, Philip R. Osborn, Wei-Shun Wang, Ellis Chau +6 more | 2015-07-28 |
| 9095074 | Structure for microelectronic packaging with bond elements to encapsulation surface | Ilyas Mohammed, Terrence Caskey, Reynaldo Co, Ellis Chau | 2015-07-28 |
| 9093291 | Flip-chip, face-up and face-down wirebond combination package | Richard Dewitt Crisp, Wael Zohni | 2015-07-28 |
| 9087815 | Off substrate kinking of bond wire | Reynaldo Co, Rizza Lee Saga Cizek, Wael Zohni | 2015-07-21 |
| 9082753 | Severing bond wire by kinking and twisting | Reynaldo Co, Rizza Lee Saga Cizek, Wael Zohni | 2015-07-14 |
| 9070423 | Single package dual channel memory with co-support | Richard Dewitt Crisp, Yong-Syuan Chen, Wael Zohni, Zhuowen Sun | 2015-06-30 |
| 9048234 | Off-chip vias in stacked chips | Ilyas Mohammed, Vage Oganesian, David Ovrutsky, Laura Wills Mirkarimi | 2015-06-02 |
| 9041133 | BSI image sensor package with embedded absorber for even reception of different wavelengths | Vage Oganesian, Ilyas Mohammed, Piyush Savalia, Craig Mitchell | 2015-05-26 |
| 9034696 | Microelectronic assemblies having reinforcing collars on connectors extending through encapsulation | Ilyas Mohammed | 2015-05-19 |
| 9030001 | Microelectronic packages with nanoparticle joining | — | 2015-05-12 |
| 9030031 | Microelectronic assembly with impedance controlled wirebond and reference wirebond | Brian Marcucci | 2015-05-12 |
| 9030017 | Z-connection using electroless plating | Cyprian Emeka Uzoh | 2015-05-12 |
| 9023691 | Microelectronic assemblies with stack terminals coupled by connectors extending through encapsulation | Ilyas Mohammed | 2015-05-05 |
| 9018769 | Non-lithographic formation of three-dimensional conductive elements | Vage Oganesian, Ilyas Mohammed, Craig Mitchell, Piyush Savalia | 2015-04-28 |
| 9013033 | Multiple die face-down stacking for two or more die | Wael Zohni, Richard Dewitt Crisp, Ilyas Mohammed, Frank Lambrecht | 2015-04-21 |
| RE45463 | Stacked microelectronic assemblies with central contacts | — | 2015-04-14 |
| 8999810 | Method of making a stacked microelectronic package | Vage Oganesian | 2015-04-07 |
| 9000600 | Reduced stress TSV and interposer structures | Cyprian Emeka Uzoh, Charles G. Woychik, Terrence Caskey, Kishor Desai, Huailiang Wei +1 more | 2015-04-07 |
| 9000583 | Multiple die in a face down package | Wael Zohni, Richard Dewitt Crisp | 2015-04-07 |
| 8994170 | Microelectronic unit and package with positional reversal | Richard Dewitt Crisp, Wael Zohni | 2015-03-31 |
| 8994195 | Microelectronic assembly with impedance controlled wirebond and conductive reference element | Brian Marcucci | 2015-03-31 |
| 8988895 | Interconnection elements with encased interconnects | Ilyas Mohammed | 2015-03-24 |