Issued Patents All Time
Showing 251–275 of 636 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9368476 | Stacked microelectronic assembly with TSVs formed in stages with plural active chips | Vage Oganesian, Ilyas Mohammed, Craig Mitchell, Piyush Savalia | 2016-06-14 |
| 9362203 | Staged via formation from both sides of chip | Vage Oganesian, Ilyas Mohammed, Craig Mitchell, Piyush Savalia | 2016-06-07 |
| 9356006 | Batch process fabrication of package-on-package microelectronic assemblies | Ilyas Mohammed, Liang Wang | 2016-05-31 |
| 9355996 | Microelectronic package with consolidated chip structures | Richard Dewitt Crisp, Wael Zohni, Ilyas Mohammed | 2016-05-31 |
| 9355959 | Active chip on carrier or laminated chip having microelectronic element embedded therein | Vage Oganesian, Ilyas Mohammed, Craig Mitchell, Piyush Savalia | 2016-05-31 |
| 9355948 | Multi-function and shielded 3D interconnects | Vage Oganesian, Ilyas Mohammed, Craig Mitchell, Piyush Savalia | 2016-05-31 |
| 9355901 | Non-lithographic formation of three-dimensional conductive elements | Vage Oganesian, Ilyas Mohammed, Craig Mitchell, Piyush Savalia | 2016-05-31 |
| 9349672 | Microelectronic package | Ilyas Mohammed, Sean Moran, Wei-Shun Wang, Ellis Chau, Christopher Wade | 2016-05-24 |
| 9349669 | Reduced stress TSV and interposer structures | Cyprian Emeka Uzoh, Charles G. Woychik, Terrence Caskey, Kishor Desai, Huailiang Wei +1 more | 2016-05-24 |
| 9337165 | Method for manufacturing a fan-out WLP with package | Hiroaki Sato, Kiyoaki Hashimoto, Yoshikuni Nakadaira, Norihito Masuda, Ilyas Mohammed +1 more | 2016-05-10 |
| 9330954 | Substrate-to-carrier adhesion without mechanical adhesion between abutting surfaces thereof | Ilyas Mohammed | 2016-05-03 |
| 9324681 | Pin attachment | Ilyas Mohammed | 2016-04-26 |
| 9318467 | Multi-die wirebond packages with elongated windows | Wael Zohni | 2016-04-19 |
| 9318460 | Substrate and assembly thereof with dielectric removal for increased post height | Kazuo Sakuma, Philip Damberg | 2016-04-19 |
| 9312244 | Multiple die stacking for two or more die | Wael Zohni | 2016-04-12 |
| 9312239 | Enhanced stacked microelectronic assemblies with central contacts and improved thermal characteristics | Wael Zohni, Richard Dewitt Crisp | 2016-04-12 |
| 9312175 | Surface modified TSV structure and methods thereof | Fatima Lina Ayatollahi, Michael Newman, Pezhman Monadgemi | 2016-04-12 |
| 9293444 | Co-support for XFD packaging | Richard Dewitt Crisp, Wael Zohni | 2016-03-22 |
| 9287216 | Memory module in a package | Wael Zohni, Richard Dewitt Crisp, Ilyas Mohammed | 2016-03-15 |
| 9287195 | Stub minimization using duplicate sets of terminals having modulo-x symmetry for wirebond assemblies without windows | Richard Dewitt Crisp, Wael Zohni, Frank Lambrecht | 2016-03-15 |
| 9287164 | Single exposure in multi-damascene process | Cyprian Emeka Uzoh, Vage Oganesian, Ilyas Mohammed, Craig Mitchell | 2016-03-15 |
| 9281271 | Stub minimization using duplicate sets of signal terminals having modulo-x symmetry in assemblies without wirebonds to package substrate | Richard Dewitt Crisp, Wael Zohni, Frank Lambrecht | 2016-03-08 |
| 9281266 | Stacked chip-on-board module with edge connector | Wael Zohni | 2016-03-08 |
| 9269692 | Stacked microelectronic assembly with TSVS formed in stages and carrier above chip | Vage Oganesian, Ilyas Mohammed, Craig Mitchell, Piyush Savalia | 2016-02-23 |
| 9241420 | In-package fly-by signaling | Richard Dewitt Crisp, Wael Zohni, Yong-Syuan Chen | 2016-01-19 |