Issued Patents All Time
Showing 276–300 of 636 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9224431 | Stub minimization using duplicate sets of signal terminals | Richard Dewitt Crisp, Wael Zohni, Frank Lambrecht | 2015-12-29 |
| 9224649 | Compliant interconnects in wafers | Vage Oganesian, Ilyas Mohammed, Piyush Savalia, Craig Mitchell | 2015-12-29 |
| 9224717 | Package-on-package assembly with wire bonds to encapsulation surface | Hiroaki Sato, Teck-Gyu Kang, Philip R. Osborn, Wei-Shun Wang, Ellis Chau +6 more | 2015-12-29 |
| 9226396 | Porous alumina templates for electronic packages | Rajesh Katkar, Cyprian Emeka Uzoh, Ilyas Mohammed | 2015-12-29 |
| 9219050 | Microelectronic unit and package with positional reversal | Richard Dewitt Crisp, Wael Zohni | 2015-12-22 |
| 9218988 | Microelectronic packages and methods therefor | Teck-Gyu Kang, Ilyas Mohammed, Ellis Chau | 2015-12-22 |
| 9214425 | Low-stress vias | Ilyas Mohammed, Cyprian Emeka Uzoh | 2015-12-15 |
| 9214454 | Batch process fabrication of package-on-package microelectronic assemblies | Ilyas Mohammed, Liang Wang | 2015-12-15 |
| 9196581 | Flow underfill for microelectronic packages | Ilyas Mohammed, Ellis Chau, Sang Il Lee, Kishor Desai | 2015-11-24 |
| 9190463 | High density three-dimensional integrated capacitors | Ilyas Mohammed, Cyprian Emeka Uzoh, Piyush Savalia, Vage Oganesian | 2015-11-17 |
| 9165906 | High performance package on package | Ilyas Mohammed | 2015-10-20 |
| 9167710 | Embedded packaging with preformed vias | Ilyas Mohammed | 2015-10-20 |
| 9159708 | Stackable molded microelectronic packages with area array unit connectors | — | 2015-10-13 |
| 9153533 | Microelectronic elements with master/slave configurability | David Edward Fisch | 2015-10-06 |
| 9153562 | Stacked packaging improvements | Craig Mitchell, Masud Beroz | 2015-10-06 |
| 9142508 | Single exposure in multi-damascene process | Cyprian Emeka Uzoh, Vage Oganesian, Ilyas Mohammed, Craig Mitchell | 2015-09-22 |
| 9137903 | Semiconductor chip assembly and method for making same | Teck-Gyu Kang, Wei-Shun Wang, Hiroaki Sato, Kiyoaki Hashimoto, Yoshikuni Nakadaira +3 more | 2015-09-15 |
| 9136197 | Impedence controlled packages with metal sheet or 2-layer RDL | Ellis Chau, Wael Zohni, Philip Damberg, Richard Dewitt Crisp | 2015-09-15 |
| 9125333 | Electrical barrier layers | Cyprian Emeka Uzoh, Vage Oganesian, Ilyas Mohammed, Piyush Savalia, Craig Mitchell | 2015-09-01 |
| 9123780 | Method and structures for heat dissipating interposers | Cyprian Emeka Uzoh, Pezhman Monadgemi, Terrence Caskey, Fatima Lina Ayatollahi, Charles G. Woychik +1 more | 2015-09-01 |
| 9123713 | Lead structures with vertical offsets | Richard Dewitt Crisp, Wael Zohni | 2015-09-01 |
| 9123664 | Stackable molded microelectronic packages | — | 2015-09-01 |
| 9123600 | Microelectronic package with consolidated chip structures | Richard Dewitt Crisp, Wael Zohni, Ilyas Mohammed | 2015-09-01 |
| 9123555 | Co-support for XFD packaging | Richard Dewitt Crisp, Wael Zohni | 2015-09-01 |
| 9111946 | Method of thinning a wafer to provide a raised peripheral edge | Ilyas Mohammed | 2015-08-18 |