Issued Patents All Time
Showing 226–250 of 636 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9508629 | Memory module in a package | Wael Zohni, Richard Dewitt Crisp, Ilyas Mohammed | 2016-11-29 |
| 9502390 | BVA interposer | Terrence Caskey, Ilyas Mohammed, Cyprian Emeka Uzoh, Charles G. Woychik, Michael Newman +3 more | 2016-11-22 |
| 9496243 | Microelectronic assembly with opposing microelectronic packages each having terminals with signal assignments that mirror each other with respect to a central axis | Richard Dewitt Crisp, Wael Zohni, Frank Lambrecht | 2016-11-15 |
| 9484333 | Multi-chip module with stacked face-down connected dies | Ilyas Mohammed, Piyush Savalia | 2016-11-01 |
| 9466587 | Multiple die in a face down package | Wael Zohni, Richard Dewitt Crisp | 2016-10-11 |
| 9461015 | Enhanced stacked microelectronic assemblies with central contacts | Wael Zohni, Richard Dewitt Crisp | 2016-10-04 |
| 9460758 | Single package dual channel memory with co-support | Richard Dewitt Crisp, Yong-Syuan Chen, Wael Zohni, Zhuowen Sun | 2016-10-04 |
| 9455181 | Vias in porous substrates | Ilyas Mohammed, Cyprian Emeka Uzoh, Piyush Savalia | 2016-09-27 |
| 9443837 | Z-connection for a microelectronic package using electroless plating | Cyprian Emeka Uzoh | 2016-09-13 |
| 9437579 | Multiple die face-down stacking for two or more die | Wael Zohni, Richard Dewitt Crisp, Ilyas Mohammed, Frank Lambrecht | 2016-09-06 |
| 9437557 | High density three-dimensional integrated capacitors | Ilyas Mohammed, Cyprian Emeka Uzoh, Piyush Savalia, Vage Oganesian | 2016-09-06 |
| 9437536 | Reversed build-up substrate for 2.5D | Liang Wang, Rajesh Katkar, Hong Shen, Cyprian Emeka Uzoh | 2016-09-06 |
| 9431475 | High density three-dimensional integrated capacitors | Vage Oganesian, Ilyas Mohammed, Piyush Savalia | 2016-08-30 |
| 9425167 | Stackable microelectronic package structures | Kyong-Mo Bang | 2016-08-23 |
| 9423824 | Stub minimization for multi-die wirebond assemblies with parallel windows | Richard Dewitt Crisp, Wael Zohni, Frank Lambrecht | 2016-08-23 |
| 9406532 | Interposer having molded low CTE dielectric | Ilyas Mohammed | 2016-08-02 |
| 9401288 | Low CTE interposer | Kishor Desai | 2016-07-26 |
| 9398700 | Method of forming a reliable microelectronic assembly | Cyprian Emeka Uzoh, Charles G. Woychik, Michael Newman, Terrence Caskey | 2016-07-19 |
| 9397063 | Microelectronic packages with nanoparticle joining | — | 2016-07-19 |
| 9385036 | Reliable packaging and interconnect structures | Cyprian Emeka Uzoh, Craig Mitchell | 2016-07-05 |
| 9378985 | Method of thinning a wafer to provide a raised peripheral edge | Ilyas Mohammed | 2016-06-28 |
| 9378967 | Method of making a stacked microelectronic package | Vage Oganesian | 2016-06-28 |
| 9377824 | Microelectronic assembly including memory packages connected to circuit panel, the memory packages having stub minimization for wirebond assemblies without windows | Richard Dewitt Crisp, Wael Zohni, Frank Lambrecht | 2016-06-28 |
| 9373565 | Stub minimization for assemblies without wirebonds to package substrate | Richard Dewitt Crisp, Wael Zohni, Frank Lambrecht | 2016-06-21 |
| 9368477 | Co-support circuit panel and microelectronic packages | Richard Dewitt Crisp, Wael Zohni | 2016-06-14 |