Issued Patents All Time
Showing 201–225 of 636 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9679613 | TFD I/O partition for high-speed, high-density applications | Zhuowen Sun, Kyong-Mo Bang, Wael Zohni | 2017-06-13 |
| 9666560 | Multi-chip microelectronic assembly with built-up fine-patterned circuit structure | Liang Wang, Guilian Gao, Hong Shen, Rajesh Katkar | 2017-05-30 |
| 9666450 | Substrate and assembly thereof with dielectric removal for increased post height | Kazuo Sakuma, Philip Damberg | 2017-05-30 |
| 9659858 | Low-stress vias | Ilyas Mohammed, Cyprian Emeka Uzoh | 2017-05-23 |
| 9659812 | Microelectronic elements with post-assembly planarization | Vage Oganesian, Craig Mitchell, Ilyas Mohammed, Piyush Savalia | 2017-05-23 |
| 9640515 | Multiple die stacking for two or more die | Wael Zohni | 2017-05-02 |
| 9640437 | Methods of forming semiconductor elements using micro-abrasive particle stream | Vage Oganesian, Craig Mitchell, Ilyas Mohammed, Piyush Savalia | 2017-05-02 |
| 9633979 | Microelectronic assemblies having stack terminals coupled by connectors extending through encapsulation | Ilyas Mohammed | 2017-04-25 |
| 9633975 | Multi-die wirebond packages with elongated windows | Wael Zohni | 2017-04-25 |
| 9633968 | Microelectronic packages having cavities for receiving microelectronic elements | Ilyas Mohammed, Wael Zohni, Philip R. Osborn | 2017-04-25 |
| 9627366 | Stacked microelectronic packages having at least two stacked microelectronic elements adjacent one another | Ilyas Mohammed | 2017-04-18 |
| 9620437 | Stacked microelectronic assembly with TSVS formed in stages and carrier above chip | Vage Oganesian, Ilyas Mohammed, Craig Mitchell, Piyush Savalia | 2017-04-11 |
| 9615456 | Microelectronic assembly for microelectronic packaging with bond elements to encapsulation surface | Ilyas Mohammed, Terrence Caskey, Reynaldo Co, Ellis Chau | 2017-04-04 |
| 9615451 | Porous alumina templates for electronic packages | Rajesh Katkar, Cyprian Emeka Uzoh, Ilyas Mohammed | 2017-04-04 |
| 9595511 | Microelectronic packages and assemblies with improved flyby signaling operation | Zhuowen Sun, Javier A. Delacruz | 2017-03-14 |
| 9570416 | Stacked packaging improvements | Craig Mitchell, Masud Beroz | 2017-02-14 |
| 9570382 | Stackable molded microelectronic packages | — | 2017-02-14 |
| 9560773 | Electrical barrier layers | Cyprian Emeka Uzoh, Vage Oganesian, Ilyas Mohammed, Piyush Savalia, Craig Mitchell | 2017-01-31 |
| 9559061 | Substrate-to-carrier adhesion without mechanical adhesion between abutting surfaces thereof | Ilyas Mohammed | 2017-01-31 |
| 9553071 | Multi-chip package with interconnects extending through logic chip | — | 2017-01-24 |
| 9553076 | Stackable molded microelectronic packages with area array unit connectors | — | 2017-01-24 |
| 9530458 | Stub minimization using duplicate sets of signal terminals | Richard Dewitt Crisp, Wael Zohni, Frank Lambrecht | 2016-12-27 |
| 9524947 | Microelectronic interconnect element with decreased conductor spacing | Chang Myung Ryu, Kimitaka Endo, Yoichi Kubota | 2016-12-20 |
| 9515053 | Microelectronic packaging without wirebonds to package substrate having terminals with signal assignments that mirror each other with respect to a central axis | Richard Dewitt Crisp, Wael Zohni, Frank Lambrecht | 2016-12-06 |
| 9508629 | Memory module in a package | Wael Zohni, Richard Dewitt Crisp, Ilyas Mohammed | 2016-11-29 |