Issued Patents All Time
Showing 151–175 of 636 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10128216 | Stackable molded microelectronic packages | — | 2018-11-13 |
| 10109903 | Flipped RF filters and components | Shaowu Huang | 2018-10-23 |
| 10103094 | Method and structures for heat dissipating interposers | Cyprian Emeka Uzoh, Pezhman Monadgemi, Terrence Caskey, Fatima Lina Ayatollahi, Charles G. Woychik +1 more | 2018-10-16 |
| 10090280 | Microelectronic package including microelectronic elements having stub minimization for wirebond assemblies without windows | Richard Dewitt Crisp, Wael Zohni, Frank Lambrecht | 2018-10-02 |
| 10083934 | Multi-chip package with interconnects extending through logic chip | — | 2018-09-25 |
| 10083909 | Embedded vialess bridges | — | 2018-09-25 |
| 10062661 | Package-on-package assembly with wire bonds to encapsulation surface | Hiroaki Sato, Teck-Gyu Kang, Philip R. Osborn, Wei-Shun Wang, Ellis Chau +6 more | 2018-08-28 |
| 10037940 | Reliable packaging and interconnect structures | Cyprian Emeka Uzoh, Craig Mitchell | 2018-07-31 |
| 10032752 | Microelectronic package having stub minimization using symmetrically-positioned duplicate sets of terminals for wirebond assemblies without windows | Richard Dewitt Crisp, Wael Zohni, Frank Lambrecht | 2018-07-24 |
| 10032751 | Ultrathin layer for forming a capacitive interface between joined integrated circuit components | Arkalgud R. Sitaram | 2018-07-24 |
| 10032646 | Robust multi-layer wiring elements and assemblies with embedded microelectronic elements | Vage Oganesian, Kimitaka Endo | 2018-07-24 |
| 10015881 | Cavities containing multi-wiring structures and devices | Cyprian Emeka Uzoh, Craig Mitchell, Ilyas Mohammed | 2018-07-03 |
| 10008477 | Microelectronic element with bond elements to encapsulation surface | Richard Dewitt Crisp, Wael Zohni | 2018-06-26 |
| 9991235 | Package on-package devices with upper RDL of WLPS and methods therefor | Min Tao, Hoki Kim, Ashok S. Prabhu, Zhuowen Sun, Wael Zohni | 2018-06-05 |
| 9991233 | Package-on-package devices with same level WLP components and methods therefor | Min Tao, Hoki Kim, Ashok S. Prabhu, Zhuowen Sun, Wael Zohni | 2018-06-05 |
| 9985007 | Package on-package devices with multiple levels and methods therefor | Min Tao, Hoki Kim, Ashok S. Prabhu, Zhuowen Sun, Wael Zohni | 2018-05-29 |
| 9984901 | Method for making a microelectronic assembly having conductive elements | Teck-Gyu Kang, Ilyas Mohammed, Ellis Chau | 2018-05-29 |
| 9972609 | Package-on-package devices with WLP components with dual RDLs for surface mount dies and methods therefor | Min Tao, Hoki Kim, Ashok S. Prabhu, Zhuowen Sun, Wael Zohni | 2018-05-15 |
| 9972582 | Warpage balancing in thin packages | Sangil Lee, Craig Mitchell, Gabriel Z. Guevara, Javier A. Delacruz | 2018-05-15 |
| 9972573 | Wafer-level packaged components and methods therefor | Min Tao, Hoki Kim, Ashok S. Prabhu, Zhuowen Sun, Wael Zohni | 2018-05-15 |
| 9966303 | Microelectronic elements with post-assembly planarization | Vage Oganesian, Craig Mitchell, Ilyas Mohammed, Piyush Savalia | 2018-05-08 |
| 9947633 | Deformable conductive contacts | Thomas L. DiStefano, III | 2018-04-17 |
| 9928883 | TFD I/O partition for high-speed, high-density applications | Zhuowen Sun, Kyong-Mo Bang, Wael Zohni | 2018-03-27 |
| 9917042 | 2.5D microelectronic assembly and method with circuit structure formed on carrier | Sean MORAN | 2018-03-13 |
| 9911717 | Stackable microelectronic package structures | Kyong-Mo Bang | 2018-03-06 |