Issued Patents All Time
Showing 351–375 of 636 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8872318 | Through interposer wire bond using low CTE interposer with coarse slot apertures | Simon J. S. McElrea, Wael Zohni | 2014-10-28 |
| 8853708 | Stacked multi-die packages with impedance control | — | 2014-10-07 |
| 8847380 | Staged via formation from both sides of chip | Vage Oganesian, Ilyas Mohammed, Craig Mitchell, Piyush Savalia | 2014-09-30 |
| 8848392 | Co-support module and microelectronic assembly | Richard Dewitt Crisp, Wael Zohni | 2014-09-30 |
| 8848391 | Co-support component and microelectronic assembly | Richard Dewitt Crisp, Wael Zohni | 2014-09-30 |
| 8847412 | Microelectronic assembly with thermally and electrically conductive underfill | Simon J. S. McElrea | 2014-09-30 |
| 8847376 | Microelectronic elements with post-assembly planarization | Vage Oganesian, Craig Mitchell, Ilyas Mohammed, Piyush Savalia | 2014-09-30 |
| 8841763 | Three-dimensional system-in-a-package | Vage Oganesian, Ilyas Mohammed, Piyush Savalia, Craig Mitchell | 2014-09-23 |
| 8841765 | Multi-chip module with stacked face-down connected dies | Ilyas Mohammed, Piyush Savalia | 2014-09-23 |
| 8835223 | Chip assembly having via interconnects joined by plating | Vage Oganesian, Ilyas Mohammed, Craig Mitchell, Piyush Savalia | 2014-09-16 |
| 8829680 | Reliable packaging and interconnect structures | Cyprian Emeka Uzoh, Craig Mitchell | 2014-09-09 |
| 8823165 | Memory module in a package | Wael Zohni, Richard Dewitt Crisp, Ilyas Mohammed | 2014-09-02 |
| 8816514 | Microelectronic assembly with joined bond elements having lowered inductance | Philip Damberg, Philip R. Osborn | 2014-08-26 |
| 8816505 | Low stress vias | Ilyas Mohammed, Cyprian Emeka Uzoh | 2014-08-26 |
| 8809190 | Multi-function and shielded 3D interconnects | Vage Oganesian, Ilyas Mohammed, Craig Mitchell, Piyush Savalia | 2014-08-19 |
| 8802502 | TSOP with impedance control | Brian Marcucci | 2014-08-12 |
| 8796135 | Microelectronic elements with rear contacts connected with via first or via middle structures | Vage Oganesian, Ilyas Mohammed, Craig Mitchell, Piyush Savalia | 2014-08-05 |
| 8796828 | Compliant interconnects in wafers | Vage Oganesian, Ilyas Mohammed, Piyush Savalia, Craig Mitchell | 2014-08-05 |
| 8791575 | Microelectronic elements having metallic pads overlying vias | Vage Oganesian, Ilyas Mohammed, Craig Mitchell, Piyush Savalia | 2014-07-29 |
| 8785790 | High strength through-substrate vias | Cyprian Emeka Uzoh, Charles G. Woychik, Terrence Caskey, Hiroaki Sato, Philip Damberg | 2014-07-22 |
| 8787032 | Enhanced stacked microelectronic assemblies with central contacts | Wael Zohni, Richard Dewitt Crisp | 2014-07-22 |
| 8787034 | Co-support system and microelectronic assembly | Richard Dewitt Crisp, Wael Zohni | 2014-07-22 |
| 8786083 | Impedance controlled packages with metal sheet or 2-layer RDL | Ellis Chau, Wael Zohni, Philip Damberg, Richard Dewitt Crisp | 2014-07-22 |
| 8786070 | Microelectronic package with stacked microelectronic elements and method for manufacture thereof | Hiroaki Sato, Norihito Masuda, Ilyas Mohammed | 2014-07-22 |
| 8786069 | Reconfigurable pop | Richard Dewitt Crisp, Wael Zohni | 2014-07-22 |