Issued Patents All Time
Showing 401–425 of 636 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8659143 | Stub minimization for wirebond assemblies without windows | Richard Dewitt Crisp, Wael Zohni, Frank Lambrecht | 2014-02-25 |
| 8659141 | Stub minimization using duplicate sets of terminals for wirebond assemblies without windows | Richard Dewitt Crisp, Wael Zohni, Frank Lambrecht | 2014-02-25 |
| 8659140 | Stub minimization using duplicate sets of signal terminals in assemblies without wirebonds to package substrate | Richard Dewitt Crisp, Wael Zohni, Frank Lambrecht | 2014-02-25 |
| 8659139 | Stub minimization using duplicate sets of signal terminals in assemblies without wirebonds to package substrate | Richard Dewitt Crisp, Wael Zohni, Frank Lambrecht | 2014-02-25 |
| 8659142 | Stub minimization for wirebond assemblies without windows | Richard Dewitt Crisp, Wael Zohni, Frank Lambrecht | 2014-02-25 |
| 8653646 | Stub minimization using duplicate sets of terminals for wirebond assemblies without windows | Richard Dewitt Crisp, Wael Zohni, Frank Lambrecht | 2014-02-18 |
| 8652935 | Void-free wafer bonding using channels | Ilyas Mohammed, Piyush Savalia, Craig Mitchell, Vage Oganesian | 2014-02-18 |
| 8641913 | Fine pitch microcontacts and method for forming thereof | Yoichi Kubota, Teck-Gyu Kang, Jae M. Park | 2014-02-04 |
| 8637968 | Stacked microelectronic assembly having interposer connecting active chips | Vage Oganesian, Ilyas Mohammed, Piyush Savalia, Craig Mitchell | 2014-01-28 |
| 8637991 | Microelectronic package with terminals on dielectric mass | — | 2014-01-28 |
| 8633576 | Stacked chip-on-board module with edge connector | Wael Zohni | 2014-01-21 |
| 8629545 | Stub minimization for assemblies without wirebonds to package substrate | Richard Dewitt Crisp, Wael Zohni, Frank Lambrecht | 2014-01-14 |
| 8623706 | Microelectronic package with terminals on dielectric mass | — | 2014-01-07 |
| 8624407 | Microelectronic assembly with impedance controlled wirebond and reference wirebond | Brian Marcucci | 2014-01-07 |
| 8618659 | Package-on-package assembly with wire bonds to encapsulation surface | Hiroaki Sato, Teck-Gyu Kang, Philip R. Osborn, Wei-Shun Wang, Ellis Chau +6 more | 2013-12-31 |
| 8610264 | Compliant interconnects in wafers | Vage Oganesian, Ilyas Mohammed, Piyush Savalia, Craig Mitchell | 2013-12-17 |
| 8610260 | Stub minimization for assemblies without wirebonds to package substrate | Richard Dewitt Crisp, Wael Zohni, Frank Lambrecht | 2013-12-17 |
| 8610259 | Multi-function and shielded 3D interconnects | Vage Oganesian, Ilyas Mohammed, Craig Mitchell, Piyush Savalia | 2013-12-17 |
| 8609540 | Reliable packaging and interconnect structures | Cyprian Emeka Uzoh, Craig Mitchell | 2013-12-17 |
| 8604348 | Method of making a connection component with posts and pads | Yoichi Kubota, Teck-Gyu Kang, Jae M. Park | 2013-12-10 |
| 8598695 | Active chip on carrier or laminated chip having microelectronic element embedded therein | Vage Oganesian, Ilyas Mohammed, Craig Mitchell, Piyush Savalia | 2013-12-03 |
| 8587126 | Stacked microelectronic assembly with TSVs formed in stages with plural active chips | Vage Oganesian, Ilyas Mohammed, Craig Mitchell, Piyush Savalia | 2013-11-19 |
| 8580607 | Microelectronic packages with nanoparticle joining | — | 2013-11-12 |
| 8581377 | TSOP with impedance control | Brian Marcucci | 2013-11-12 |
| 8575766 | Microelectronic assembly with impedance controlled wirebond and conductive reference element | Brian Marcucci | 2013-11-05 |