Issued Patents All Time
Showing 426–450 of 636 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8569884 | Multiple die in a face down package | Wael Zohni, Richard Dewitt Crisp | 2013-10-29 |
| 8553420 | Enhanced stacked microelectronic assemblies with central contacts and improved thermal characteristics | Wael Zohni, Richard Dewitt Crisp | 2013-10-08 |
| 8541873 | Microelectronic packages having cavities for receiving microelectronic elements | Ilyas Mohammed, Wael Zohni, Philip R. Osborn | 2013-09-24 |
| 8531020 | Stacked packaging improvements | Craig Mitchell, Masud Beroz | 2013-09-10 |
| 8531039 | Micro pin grid array with pin motion isolation | Philip Damberg, David B. Tuckerman, Teck-Gyu Kang | 2013-09-10 |
| 8525338 | Chip with sintered connections to package | Hiroaki Sato, Kiyoaki Hashimoto, Yoshikuni Nakadaira, Norihito Masuda, Ilyas Mohammed +1 more | 2013-09-03 |
| 8525314 | Stacked packaging improvements | Craig Mitchell, Masud Beroz | 2013-09-03 |
| 8525327 | Stub minimization for assemblies without wirebonds to package substrate | Richard Dewitt Crisp, Wael Zohni, Frank Lambrecht | 2013-09-03 |
| 8513817 | Memory module in a package | Wael Zohni, Richard Dewitt Crisp, Ilyas Mohammed | 2013-08-20 |
| 8513813 | Stub minimization using duplicate sets of terminals for wirebond assemblies without windows | Richard Dewitt Crisp, Wael Zohni, Frank Lambrecht | 2013-08-20 |
| 8513794 | Stacked assembly including plurality of stacked microelectronic elements | Ilyas Mohammed | 2013-08-20 |
| 8513789 | Edge connect wafer level stacking with leads extending along edges | Vage Oganesian | 2013-08-20 |
| 8512491 | Dual wafer spin coating | Vage Oganesian, Ilyas Mohammed, Piyush Savalia, Craig Mitchell | 2013-08-20 |
| 8502390 | De-skewed multi-die packages | Richard Dewitt Crisp, Wael Zohni | 2013-08-06 |
| 8502340 | High density three-dimensional integrated capacitors | Vage Oganesian, Ilyas Mohammed, Piyush Savalia | 2013-08-06 |
| 8486758 | Simultaneous wafer bonding and interconnect joining | Vage Oganesian, Ilyas Mohammed, Piyush Savalia, Craig Mitchell | 2013-07-16 |
| 8487421 | Microelectronic package with stacked microelectronic elements and method for manufacture thereof | Hiroaki Sato, Norihito Masuda, Ilyas Mohammed | 2013-07-16 |
| 8482111 | Stackable molded microelectronic packages | — | 2013-07-09 |
| 8476774 | Off-chip VIAS in stacked chips | Ilyas Mohammed, Vage Oganesian, David Ovrutsky, Laura Wills Mirkarimi | 2013-07-02 |
| 8466564 | Enhanced stacked microelectronic assemblies with central contacts and improved ground or power distribution | Wael Zohni, Richard Dewitt Crisp | 2013-06-18 |
| 8466542 | Stacked microelectronic assemblies having vias extending through bond pads | Moshe Kriman, Osher Avsian, Giles Humpston, Dmitri Burshtyn | 2013-06-18 |
| 8461673 | Edge connect wafer level stacking | Vage Oganesian | 2013-06-11 |
| 8461672 | Reconstituted wafer stack packaging with after-applied pad extensions | Giles Humpston, David Ovrutsky, Laura Wills Mirkarimi | 2013-06-11 |
| 8461460 | Microelectronic interconnect element with decreased conductor spacing | Chang Myung Ryu, Kimitaka Endo, Yoichi Kubota | 2013-06-11 |
| 8441111 | Stub minimization for multi-die wirebond assemblies with parallel windows | Richard Dewitt Crisp, Wael Zohni, Frank Lambrecht | 2013-05-14 |